Dipsoldering describes a (usually simultaneous) selective soldering process in which the solder nozzle is guided purely vertically to the assembly, the solder joint is dipped into the solder. In contrast to wave soldering, there is no horizontal movement between the assembly and the solder wave(s). The process is mostly used for multiwave soldering. The solder nozzles are arranged in a product-specific manner, their shape depends on the layout of the assembly and is determined by the geometry of the THT components to be soldered and the clearance to adjacent SMDs. The product-specific tool on which the solder nozzles are arranged is called a nozzle plate.