Overprinting is used when more solder paste is needed for a solder joint than will fit on the copper pad. Then the stencil opening is made larger than the copper pad. With reflow soldering, the solder retracts onto the copper pad and thus creates a higher solder volume than with normal printing.
More elegant is the use of a step stencil, which allows an increase in solder volume without overprinting.
Overprinting is often used in through hole reflow or pin in paste technology. In order to fill the entire through-hole with solder, a lot of solder paste must be printed onto the corresponding pads due to the metal content (volume) of the solder paste of only approx. 50%. Since the given pad area is usually not sufficient for this, "overprinting" is done. Overprinting is critical, however, because the paste must flow back onto the pad as a whole when it melts. If the paste separates when it is pulled back, solder balls are formed.
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