The Pin in Paste process uses solder paste printing and the reflow soldering process to create a solder joint for the through-hole technology. The amount of solder required for the solder joint is calculated in advance. The calculated solder volume is converted to the paste volume to be applied. It is important to use the information for the volume fraction of the metal content of the solder paste (approx. 50%). The required volume is then printed onto the PCB surface and into the via. Through-hole fillings of <60% of the PCB thickness have proven successful (no squeezing out of the solder paste during insertion). To ensure these values, it is necessary to partially cover the vias with a stencil bar. The volume can be additionally increased with the use of step stencils or solder mouldings.
Cookies on kurtzersa.de
We use cookies to personalize content and ads, to provide social media features, and to analyze traffic to our website. We also share information about your use of our website with our social media, advertising and analytics partners. Our partners may combine this information with other information that you have provided to them or that they have collected as part of your use of the services. Further information in the Privacy policy.
Strictly necessary cookies to ensure the functionality of the website.
These technologies enable us to analyze the use of the website in order to measure and improve performance.
These technologies are used by advertisers to serve ads that are relevant to your interests.