Also called stamp soldering or resistance soldering. For this process, a stamp corresponding to the outline of the component to be soldered is being used. With a resistance heater, this stamp is heated up with short impulses, while pressing the pre-tinned components to the pad and melting the solder. With resistance soldering an intense heat can be rapidly developed directly within the joint area and in a tightly controlled manner. This allows a faster ramp up to the required solder melt temperature and minimizes thermal travel away from the solder joint, which helps to minimize the potential for thermal damage to materials or components in the surrounding area. Heat is only produced while each joint is being made.
Cookies on kurtzersa.de
We use cookies to personalize content and ads, to provide social media features, and to analyze traffic to our website. We also share information about your use of our website with our social media, advertising and analytics partners. Our partners may combine this information with other information that you have provided to them or that they have collected as part of your use of the services. Further information in the Privacy policy.
Strictly necessary cookies to ensure the functionality of the website.
These technologies enable us to analyze the use of the website in order to measure and improve performance.
These technologies are used by advertisers to serve ads that are relevant to your interests.