In vacuum soldering, the assembly is transported into a vacuum chamber after the peak zone of the reflow oven and exposed to a vacuum. The resulting pressure difference removes gas inclusions from the still liquid solder of the solder joints. In this way, the number of voids in the solder joints can be significantly reduced. This is particularly relevant for applications where the solder joints have to transfer high currents or dissipate a lot of heat into heat sinks (power electronics, LEDs). Also the reliability of the solder joints and the RF properties are improved.

Overview