VERSAPRINT 2 ULTRA³ Ersa Stencil Printing
World´s first stencil printer with integrated 3D inspection
The ULTRA³ model uses the latest 3D LIST camera measurement technology. The shape of the smallest solder paste deposits plays a major role in the printed volume and ultimately the shape of the solder joint. Is the paste deposit the same height over the entire surface or does it slope towards the edges? This question is answered by the ULTRA³, which combines a stencil printer and 3D SPI.
Advantages of VERSAPRINT 2 ULTRA³ compared to 3D SPI stand-aloneHighlights Ersa Stencil Printing
Advantages of VERSAPRINT 2 ULTRA³ stencil printer compared to 3D-SPI stand-alone
- 3D-SPI for inspecting complex boards directly after the printing process
- Detection of errors through stencil inspection before they occur
- Zero point measurement of the unprinted LP at any time before printing
- Integrated closed-loop function for print offset
- Consistent software platform for printing and inspection
- Maintenance and servicing for one machine, one AP for both processes
- Less space required in the production line
VERSAPRINT 2 ULTRA³Ersa Videos
Ersa Stencil Printer – VERSAPRINT 2 Ultra³ – product video
Ersa Stencil Printer – VERSAPRINT 2 Ultra³ – product video
Applications VERSAPRINT 2 ULTRA³Ersa Stencil Printing
Print head & squeegee
Stencil underside cleaning
- Parameter setting for wet, dry and vacuum cleaning
- With controlled paper feed for reproducible cleaning cycles and adapted material consumption
- Intelligent stencil cleaner
Cleaning the underside of the stencil
- Parameter setting for wet, dry and vacuum cleaning
- With controlled paper feed for reproducible cleaning cycles and adapted material consumption
- Intelligent stencil cleaner
Substrate handling and parallel process
- Clamping substrate between hold-down bar and conveyor belt
- Secure fixing of thin substrates without warping
- Minimal bounce and overlapping of the substrate in the edge area
VERSAPRINT 2 ULTRA³Ersa Stencil Printing
Technical data
Substrate size (X x Y):
min. 50 x 50 mm, max. 680 x 500 mm (inspection area 550 x 500 mm)
Optional stencil cleaner:
680 x 500 mm
Substrate thickness:
0.5-6 mm
Component clearance:
up to 35 mm
Stencil size:
min. 450 x 450 mm, max. 737 x 737 mm adjustable without tools
Print head:
two independent squeegee heads with continuous squeegee force control, squeegee depth stop and oscillation limiter
Squeegee force:
0-230 N
Camera:
3D line scan camera for alignment and inspection of substrate and stencil
Repeat accuracy:
+/-12.5 µm @ 6 Sigma
Print accuracy:
+/-25 µm @ 6 sigma
Cycle time:
10 s + print
Setup time:
under 10 min
Product changeover:
under 2 min
Graphical user interface:
touchscreen
