No-Clean fluxes leave residues that do not necessarily have to be removed from the soldered assemblies. Under normal conditions of use of the assemblies in the field, the No-Clean residues do not pose any risk of corrosion. Fluxes that are not classified as No-Clean often contain acids or chlorides. These compounds do not decompose during soldering and remain active on the assembly surface after the soldering process. To prevent corrosion, these residues must be washed off the assemblies immediately after the soldering process without leaving any residue.

Overview