The property of a paste to reduce its viscosity when force is applied. After the end of the application of force, the paste immediately returns to its initial viscosity.

Thixotropic agents are added to solder pastes so that the solder paste flows more easily into the openings under the pressure of the squeegee during stencil printing, fills them repeatably and reproduces the shape of the stencil opening without running after release from the stencil.

Overview