Selective soldering places high demands on the nozzle, solder, and process—especially with dense THT layouts, limited accessibility, and critical breakaway behavior. This white paper provides you with a concise, practical overview of nozzle types, key properties (e.g., wettability), and typical causes of wear—including clear application tips for more stable results.
What you take with you:
- Mini wave vs. multi wave: differences, strengths, applications
- Wettable vs. non-wettable nozzles: influence on breakup, bridges, and process window
- Geometry & material: what matters when it comes to selection and energy input
- Service life & maintenance: oxidation, wear, activation – avoiding typical mistakes
- Important note on solder additives (e.g., phosphorus) and their effects
Who is this white paper intended for?
- Process/production engineers (selective soldering/THT)
- Setup technicians/programmers and production managers
- Quality/industrial engineering