Technology Days planned and held exclusively for companies

For technology companies from Germany and abroad, we offer customized technology days that are put together individually. As the seminars are planned and held exclusively for your company, the theoretical and practical phases can be tailored precisely to the needs of your employees. In addition, the exchange of knowledge and experience is encouraged among your own employees across departments and locations.

The focus of the 1 or 2-day intensive training course is to consider and analyze all the boundary conditions affecting the soldering process.

Technology days for auditors

Exclusively for users who are downstream of the soldering process in the supply chain, we offer technology days that deal specifically with the process technology knowledge relevant to you. Our experts will give you an insight into our technologies and processes and explain what you need to consider when auditing suppliers, for example.

We also take the time to answer your specific questions about joining technology.

Design your Technology Days together with us from the following modules

Solder paste printing module

  • Stencils - types, layout
  • Print media and parameters
  • Printing errors and their causes

Reflow soldering module

  • Definition of process windows
  • Soldering defects and their causes
  • Quality parameters in reflow soldering

Wave and selective soldering module

  • Requirements for the printed circuit board and the printed circuit board design
  • Selective soldering mini and/or multi wave
  • Process window and production throughput

Press-fit module

  • Requirements for the PCB and the PCB design
  • Variance of the press-fit zones
  • Influencing factors and monitoring of the process

Optical inspection module

  • Assistance instead of control
  • Influence of cleaning and calibration intervals on test quality, defect detection and reduction

Module Design

  • Design PCB technology and production-oriented design for the economical production of reliable electronic assemblies

Module Application Field High Power Electronics

  • Design challenges for highly reliable assemblies & components
  • Optimized PCB layout under thermodynamic aspects
  • Flexible system concepts that enable precise adaptation of the process parameters to the individual solder joints, taking into account throughput and variant diversity

Practice in the Application Center:

In the practical section, the machine setup and practical application are demonstrated. The focus here is on parameter setting and monitoring as well as the influence on the soldering result when the parameters are within and outside the limit range.

Your benefit

  • Understand and interpret your supplier's processes
  • Stay one step ahead and demand the latest technologies

Dates
on request

Program
Can be individually combined in consultation and on request

Course documents
in printed form

Number of participants
min. 6 persons

Fee
1st day: 475 € per person plus VAT. VAT.
2nd day: 375 € per person plus VAT. VAT.
Exam fee: 100 € per person plus VAT. VAT.

Optional examination for all participants with subsequent issue of certificate. Seminar participants who do not take the exam will receive a certificate of attendance.

References
Automotive manufacturers, industrial electronics, drive technology, consumer electronics