Technology Days planned and held exclusively for companies

For technology focused companies we offer customer-specific Technology Days, which are arranged according to individual topics and needs. Since the seminars are organized and conducted exclusively for your company, the theoretical and practical sessions can be tailored exactly to the needs of your employees. In addition, the exchange of knowledge and experience among your own employees across departments and locations is stimulated. The focus of the two-day intensive course is to observe and analyze all boundary conditions affecting the soldering process.

Technology days for auditors

Exclusively for users who are not directly involved in the soldering processes, we offer Technology Days that deal specifically with the process knowledge that is relevant to you. Our experts will give you an insight into our technology, processes and explain, for example, what needs to be taken into account when auditing suppliers in these processes. In addition, we take the time to explicitly address your questions about joining technology.

Design your technology days from the following modules

SOLDER PASTE PRINTING

SOLDER PASTE PRINTING

  • Stencil types, layouts
  • Printing materials and parameters
  • Printing defects and their causes

REFLOW SOLDERING

REFLOW SOLDERING

  • Definition of process windows
  • Soldering defects and their causes
  • Quality parameters in reflow soldering

REWORK

REWORK

  • Rework of electronic assemblies
  • Creating selective reflow profiles
  • Removing residual solder and placing new components

WAVE & SELECTIVE SOLDERING

WAVE & SELECTIVE SOLDERING

  • Demands on PCB and design
  • Selective mini- and/or multi-wave soldering
  • Process windows and production throughput

PRESS-FIT

PRESS-FIT

  • Requirements for the PCB and the PCB design
  • Variants of the press-fit zones
  • Influencing factors and monitoring of the process

HAND SOLDERING

HAND SOLDERING

  • Process requirements
  • Influencing parameters and their causes
  • Traceability/Process control in manual soldering

SOLDERING TECHNOLOGY FOR HIGH RELIABILITY ELECTRONICS

SOLDERING TECHNOLOGY FOR HIGH RELIABILITY ELECTRONICS

  • Design challenges for high reliability assemblies and devices
  • Optimized PCB layout under thermo-dynamic aspects
  • Flexible system concepts which, considering throughput and variant range, allow precise adaptation of the process parameters to the individual solder joints

DESIGN

DESIGN

  • Basics of PCBs and design for manufacturing for the economical production of reliable electronic assemblies

OPTICAL INSPECTION

OPTICAL INSPECTION

  • Assistance instead of control
  • Influence of cleaning and calibration intervals on the test quality
  • Detection and reduction of defects

SEMICONDUCTOR

SEMICONDUCTOR

  • Process parameters and their correlations

PRACTICAL SESSION IN THE ERSA APPLICATION CENTER

The practical session covers the machine construction and the practical application. The main focus is on parameter setting
and monitoring, as well as the effect on the soldering result when parameters are within or outside of the limits

YOUR BENEFITS

  • Understand and interpret your supplier´s processes
  • High quality at the lowest possible cost
  • Being one step ahead and demanding the latest technologies
  • Future-oriented market approach

Dates: on request

Agenda NEW → LEVELS!

  • Basic: 2 days
  • Advanced 2.5 days

Course documentation in printed form

Participants: Minimum of 6 attendees

Fee

  • Basic: 999,- € per person plus VAT
  • Exam fee: 100,- € per person plus VAT

Optional examination for all participants with subsequent issue of certificate. Seminar participants who do not take the exam will receive a certificate of attendance.

References: Automotive manufacturers, industrial electronics, drive technology, consumer electronics