HR 600 P – automated rework precision

The HR 600 P hybrid rework system focuses on precision and automation, as it is particularly suitable for SMD components with very fine grids and reliably processes small SMT components and BGAs up to a size of 60 x 60 mm. The automatic soldering and placement processes are supplemented by automatic, non-contact residual solder removal and non-contact temperature monitoring.
HR 600 P: Smart component repair

Highlights HR 600 PErsa Rework

  • Highly efficient 800-W hybrid heating head
  • Homogeneous, high-performance IR bottom heating in six zones
  • Automatic and precise component alignment using image processing
  • High-precision, motorized axis system for component placement (+/- 0.025 mm)
  • Guaranteed, user-independent, reproducible repair results
  • Process control and documentation via the HRSoft operating software
  • Fully automatic or semi-automatic operation
  • Suitable for use with the Dip & Print Station

Product FeaturesHR 600 P

HR 600 PErsa Videos

Automatic residual solder removal for HR 600 PHR 600 P

Before a new component can be soldered onto a circuit board, the solder remaining on the circuit board after desoldering must be removed. In an automated process, the Auto Scavenger SC 600 gently removes the remaining solder from the connection surfaces on the PCB. The module can also be retrofitted and is fully integrated into the HRSoft 2 software.

Patent notice:

This product may be protected by one or more U.S. patents, including: U.S. Patent No. US10217211B2

Patent notice:

This product may be protected by one or more U.S. patents, including: U.S. Patent No. US10217211B2

HR 600 PErsa Rework

Technical data

Dimensions (LxWxH) in mm:
1,450 x 800 x 600
Weight in kg:
110 kg (128.5 kg incl. SC 600)
Nominal power in W:
6,300 W (incl. Scavenger 6,700 W)
Preheating top:
hybrid radiators, 800 W, in two zones, 60 x 60 mm
Preheating bottom:
IR emitter, 380 x 380 mm
PCB size in mm:
up to 380 x 300 mm (+x), option: up to 642 x 423 mm (+x)
Component size in mm:
1 x 1 mm to 60 x 60 mm
Axis accuracy:
up to +/- 25 µm
Working distance (typical):
30-60 mm to top heater, 35 mm to bottom heater
Placement camera (top):
5 MP GigE color camera
Component camera (bottom):
5 MP GigE monochrome camera
Reflow process camera:
6.3 MP, CMOS GigE color camera, 50 mm focal length, illumination 2x LED, adjustable
Compressed air connection:
to be provided by the customer, oil-free, ¼ inch, 6-10 bar
Operating software:
HRSoft 2

Order information

Article no.:
Description
0HR600P:
Ersa HR 600P with PCB holder 380 x 300 mm (+x)
0SC600:
SC 600 - automatic residual solder removal
Other system configurations on request

Patent notice:

This product may be protected by one or more U.S. patents, including: U.S. Patent No. US10217211B2