Guided Rework System Ersa HR 550 XL Ersa Rework
Large and flexible: guided rework for large boards up to 530 x 610 mm
With the HR 550 XL, Ersa presents a semi-automatic device for large assemblies up to approx. 530 x 610 mm - a real performance package with eight bottom radiator heating zones, motorized X/Y fine adjustment and component rotation. The system is suitable for industrial and power electronics as well as large-format PCBs and is particularly attractive for service providers.
Highlights HR 550 XLErsa Rework
- 1,800 W hybrid high-performance heating element
- Full-surface 6,400 W IR underheating
- High-resolution cameras for placement and process monitoring
- Computer-aided component alignment, digital "split optics"
- Ergonomically optimized system operation
- Modern, user-friendly operating software
Advantages HR 550 XLErsa Rework
The technology of Ersa rework systems ensures sustainable added value in electronics production:
- Gentle heating technology
- Sensor-guided soldering processes
- Contactless residual solder removal
- Precise component placement
- Complete process documentation
- Clear user guidance
Applications HR 550 XLErsa Rework
HR 550 XLErsa Videos
Ersa Rework System – HR 550 – product video
Ersa Rework System – HR 550 – product video
Ersa Guided Rework – HR 550 – Trailer
Ersa Guided Rework – HR 550 – Trailer
HR 550 XLErsa Rework
Technical data
- Dimensions (WxDxH) in mm: 755 x 930 x 545/747 (heating head bottom/top)
- Weight in kg: 102 kg, including control panel
- Antistatic version (y/n): yes
- Rated power in W: 8,200
- Rated voltage in V AC: 3 x 400 VAC, 50-60 Hz, 16 A
- Top heater: Hybrid heater 900 W infrared + 900 W hot air, 70 x 70 mm
- Bottom heater: IR heater (8 x 800 W), 530 x 530 mm
- PCB size in mm: up to 530 x 610 (+x), up to --0 x --0 mm (+x); (0HR550XL-L)
- Component size in mm: from 0.2 x 0.4 (01005) to 70 x 70
- Measuring channels: 3x K-type, 1 x IRS
- Position laser: Class II
- Operating software: HRSoft 2 - suitable for Windows 8, 10 and Windows 11
- Test mark: CE
- Placement camera top: 5 MP GigE color camera, field of view 70 x 70 mm (wide angle), 25 x 33 mm (telephoto)
- Option: Reflow process camera: 2.3 MP, CMOS GigE color camera, 25 mm focal length, illumination 2x LED, adjustable
- Working depth: 349 mm (rotation of the assembly may be necessary)
- Working distance (typical): 30-60 mm to top heater, 35 mm to bottom heater
- Compressed air connection: 6-10 bar (oil-free), ¼ inch quick coupling
- Cooling air volume: approx. 65 l/min (@ 6 bar)
- Component rotation and x/y adjustment motorized, tip operation with a resolution of less than 20 µm
Recommended accessories
Article no.:
Description
0HR510:
Reflow process camera for monitoring reflow processes
0IR6500-37:
AccuTC sensor without mounting K-type for the second measuring channel
0IR4510-02:
Thermal sensor cable K-type, for the second measuring channel
Dip&Print Station (0PR100):
Well prepared: defined flux or solder paste application during rework
Ersa SCAVENGER (0SC550):
Non-contact residual solder removal for HR 550 and HR 550 XL
Order Information
Article no.:
Description
0HR550XL:
Ersa HR 550 XL with PCB holder 610 x 530 mm (+x)
0HR550XLL:
Ersa HR 550 XL with PCB holder 680 x 600 mm (+x)
0HR510:
Reflow process camera (RPC) for HR 500, HR 550 and HR 550 XL
0PR100:
Dip&Print Station, complete
0SC550:
Ersa Scavenger - residual solder removal module, suitable for all HR 550 and HR 550 XL rework systems
