SRO-700 - Vacuum Soldering System for R&D Kurtz Ersa Semicon
The SRO-700 vacuum soldering system is for semiconductor and MEMS applications, offering 97 mm clearance over the heated surface. It can be used for vacuum soldering processes for low volume production or R&D. The cold wall chamber principle supports effective thermal management, while the IR heating technology provides consistent heat distribution. Using vacuum and formic acid, the SRO-700 ensures void-free solder joints and delivers consistent, reliable results every time.
Technical HighlightsSRO-700
- Formic acid enriched atmosphere
- Direct IR heating
- Multiple TC monitoring
- Process temperature up to 450 °C
- Oxygen <3.0 ppm with purified N2
Common ApplicationsSRO-700
- Power semiconductors (IGIBT, SiC-MOSFET)
- Sensors
- MEMS devices
- Die Attachment
- High-power LED
- Hybrid assembly
- Flip Chip
- Package sealing
Backend Semiconductor Production SRO-700Semicon
SRO-700Semicon
Technical data
Dimensions:
560 x 870 x 600 mm
Weight:
65 kg
Maximum product height:
97 mm
Heated area:
227 x 217 mm
Heating method:
Arrangement of 8 IR emitters in 2 zones
Vacuum level:
<0.05 mbar
Options
- Fine vacuum
- High vacuum
- Closed loop water chiller/heater
