The POWERFLOW ONE is the ideal entry-level machine for small electronics manufacturers who rely on proven Ersa quality and reliability. The machine has a small footprint and reduces downtime to an absolute minimum. This is made possible by the use of established components such as solder pots and heaters, which have proven themselves over many years in the POWERFLOW line of systems.

1/5

Ersa POWERFLOW ONE - THE ONE. FOR EVERYONE.

2/5

Ersa POWERFLOW ONE - proven components

3/5

Ersa POWERFLOW ONE - KE.ON Software

4/5

Ersa POWERFLOW ONE - small footprint

5/5

Ersa POWERFLOW ONE - added values

Technology Highlights POWERFLOW ONEErsa Wave Soldering

  • Enter the world of POWERFLOW with a length of only 2.90 m
  • Powerful preheating with 3 cassettes (2x medium wave, 1x bright radiator)
  • Proven crucible technology with a filling volume of only 345 kg
  • Nitrogen option
  • Optional finger transport
  • Optional inline capability

Your advantagesPOWERFLOW ONE

  • Modular state-of-the-art software architecture
    Equipped for future requirements in terms of security, stability, and flexibility
  • Optimized machine data acquisition
    Efficient process design and smart features
  • Modern, intuitive user interface
    Comprehensive user management and easy operation

POWERFLOW ONEErsa Wave Soldering

POWERFLOW ONE

Compact design and cost efficiencyPOWERFLOW ONE

The POWERFLOW ONE is a compact machine with a length of 2.90 m, which provides a cost-effective entry point into the Ersa wave soldering portfolio. It focuses on the essentials of wave soldering and combines excellent value for money with proven Ersa quality. The basic version has a wave former and is designed for stand-alone operation with a soldering frame. The reduced pot volume supports cost-efficient operation. Optional extensions allow upgrades and adaptations up to high-performance inline operation.

POWERFLOW ONEErsa Wave Soldering

Technical data

Length:
2,900 mm
Width:
1,481 mm
Height:
1,590 mm (with inlet height 635 mm; outlet height 1,066 mm)
Weight:
1,500 kg

Transport systems

Frame transport, finger transport:
PCB width finger transport:
406.4 mm
PCB width frame transport:
400 mm
PCB length:
120-500 mm
PCB structures:
100 mm
Transport speed:
0.5 m/min to 1.8 m/min

Preheating/Solder module

Preheating module at bottom:
Dynamic power:
5.2 kW
Medium wave power:
2x 4 kW
Soldering module:
Power:
9.2 kW
Solder content (SnPb37):
630 kg
Solder content (SAC305):
525 kg (optional 345 kg)
Heating time (to 260 °C):
approx. 210 min (optional 180 min at 345 kg)
Max. solder temperature:
300 °C