The new flagship for ultimate wave soldering

The Ersa POWERFLOW FIVE is the latest generation of Ersa wave soldering systems and sets the benchmark in the ultra-high segment. It is specifically designed to meet the dynamic requirements of today´s and tomorrow´s markets - for example, in the areas of e-mobility, 5G, and smart grids. The POWERFLOW FIVE is aimed at electronics manufacturers with a particular focus on demanding applications in power electronics.

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Ersa POWERFLOW FIVE – HIGH FIVE for wave soldering!

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Ersa POWERFLOW FIVE - sequential soldering with dynamic z-axis

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Ersa POWERFLOW FIVE - Heavy-duty transport up to 25 kg

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Ersa POWERFLOW with SMART ELEMENTS

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Ersa POWERFLOW FIVE with SMART IR RADIATION

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Ersa POWERFLOW FIVE - SMART WAVE GUARD

Technology Highlights POWERFLOW FIVEErsa Wave Soldering

  • Soldering module with new dynamic z-axis and sequential soldering
  • SMART WAVE GUARD for precise monitoring of wave height
  • Heavy-duty transport up to 25 kg
  • Highly efficient SMART ELEMENTS® process gas purification
  • Energy savings through hybrid heating and SMART IR RADIATION

POWERFLOW FIVEErsa Wave Soldering

POWERFLOW FIVE

POWERFLOW FIVEErsa Wave Soldering

Dynamic z-axis and sequential soldering 2.0

In the electronics production of the future, more and more power electronic and digital components will be combined on the same product. It is therefore necessary to be able to adjust the distance between nozzles and circuit boards individually for each product and to specify different distances within a product. The POWERFLOW FIVE features a new dynamic z-axis control for sequential soldering 2.0 - this new z-axis allows distances between the waveform generator and flat assembly of 5 to 18 mm. The second waveform generator is also independently adjustable in height. All settings can be conveniently adjusted via the operating software. The independent nozzle adjustment dynamically adapts to different requirements. With an accuracy of 0.1 mm and 10 individually controllable sections, sequential soldering 2.0 guarantees perfect solder joints for even the most complex mixed-technology assemblies. 

SMART WAVE GUARD wave height control and adjustment

The soldering module enables 1.5 mio. maintenance-free strokes, guaranteeing maximum availability. To keep the wave height constant, the POWERFLOW FIVE features new measurement technology that checks the solder wave height at regular intervals and automatically adjusts the solder overflow if necessary. This ensures uniform wetting and constant pressure at the nozzle outlet.

POWERFLOW FIVEErsa Wave Soldering

Technical data

Length:
5,830 mm (3 preheaters), 6,580 mm (4 preheaters)
Width:
1,760 mm
Height:
1,580 mm
Weight:
2,400 kg (FIVE XL: 2,600 kg, FIVE XXL: 3,100 kg)

Transport systems

Frame transport, external frame transport, finger transport:
PCB width finger transport:
60-406 mm (heavy duty 25 kg: 150-406 mm)
PCB width external frame transport:
350/400 mm
PCB width frame transport:
330/400 mm
PCB length:
120-600 mm
Clearance height at top:
80 mm (optional 120 + 150 mm)
Transport speed:
0.5 m/min to 2.5 m/min (heavy duty 25 kg: 0.5 m/min to 1.6 m/min)

Preheating/Solder module

Preheating module, bottom:
Dynamic power:
10.4 kW
Medium wave power:
6 kW
Convection power:
10.2 kW
Hybrid heating power:
6 kW
SMART IR RADIATION power:
10.4 kW
Preheating module, top:
Power, medium wave:
6 kW
Power, dynamic:
10.4 kW
Power, convection:
6 kW
Soldering module:
Power:
9.2 kW
Solder content (SnPb37):
630 kg
Solder content (SAC305):
525 kg
Heating time (to 260 °C):
approx. 210 min
Max. soldering temperature:
300 °C