Modular selective platform for highly efficient and flexible inline soldering

In order to meet all requirements in terms of flexibility, a modular machine platform was created with the third VERSAFLOW generation. The basic version includes fluxing, preheating and soldering modules with a segmented conveyor system. Depending on the application and throughput rate requirements, additional fluxing, preheating or soldering modules can be added. With the double-track option, the throughput rate can be doubled without increasing the machine's space requirements. If the size of the assembly allows the preheating modules to be segmented, the throughput rate can be increased even further. If all available features are used, up to 22 assemblies can be processed simultaneously in the VERSAFLOW 3/45.

Unique technology advantagesVERSAFLOW 3/45

  • High-end selective soldering system for integration into inline production concepts
  • Mini wave soldering for high flexibility or multi wave soldering for high volume applications
  • Product changeover without downtime even with multiwave processes
  • Parallel process due to the  separation of fluxing, preheating and soldering
  • Use of up to 4 spray heads
  • Up to 5 preheating modules at the bottom with optional convection top heating
  • Flexible system configuration thanks to modular design
  • Ideal for integration with assembly stations and peripherals
  • IPC CFX certification

VideoVERSAFLOW 3/45

Ersa Selective Soldering – VERSAFLOW 3/45

Ersa Selective Soldering – VERSAFLOW 3/45

VERSAFLOW 3/45Ersa Selective Soldering

Technical Data

 

    Length:
    from 2,450 to 7,500 mm
    Width:
    1,750 mm
    Height:
    1,650 mm

    Conveyor systems

      • Pin chain conveyor or roller conveyor
      • PCB width: 63.5-508 mm (opt. 600 mm)
      • PCB length: 127-508 mm (opt. 600 mm)
      • Max. PCB top structures up to 120 mm
      • Max. Max. circuit board structures at the bottom up to 60 mm (30 mm for z-variable modules)
      • Max. PCB weight: 5 kg (opt. 15 kg)

    Fluxer/Preheating/Soldering module

    • Fluxer: Drop-Jet in verschiedenen Größen
       

    • Vorheizung: IR-Strahlerheizung, Konvektion oder Kombination von IR und Konvektion
       

    • Lötmodul:

      • elektromagnetischer Löttiegel

      • Miniwelle 13 kg bis zu 6 Tiegel

      • Multi-wave-Lötfläche bis zu 356x356 mm / 360x340 mm / 370x425 mm

      • LP-Größe bis zu 406x508 mm

    Fluxer: Drop jet in various sizes:
    Preheating: IR radiator heating, convection or combination of IR and convection:
    Soldering module:Electromagnetic soldering potMini wave 13 kg up to 6 potsMulti-wave soldering surface up to 356x356 mm / 360x340 mm / 370x425 mmLP size up to 406 x 508 mm: