VERSAFLOW ONE X - Highest throughput in the entry-level segment thanks to variable X-axis and up to 4 solder pots

Your entry into the excellence class of high-speed selective soldering: The VERSAFLOW ONE offers the highest throughput in the entry-level segment of Ersa VERSAFLOW inline selective soldering systems thanks to the variable X-axis. The system combines proven Ersa DNA and a customer-oriented option structure at extremely attractive purchase and operating costs.

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Technical HighlightsVERSAFLOW ONE X

  • Proven VERSAFLOW high-end technology with variable x-axis
  • World market leading quality and service
  • Award-winning user interface
  • Compact dimensions with 4 configurations with up to 4 pots in 2 modules
  • Simultaneous processing of up to 10 PCBs with max. 350 x 508 mm
  • Attractive price/performance ratio and 10% energy savings

Your BenefitsVERSAFLOW ONE X

 

  • Your entry into the VERSAFLOW world with leading technology and best soldering quality
  • Future-proof and sustainable investment with Ersa premium services
  • Fast commissioning, soldering program setup and intuitive operation
  • Highest throughput due to simultaneous soldering of 4 PCBs
  • Reduced operating costs and fast ROI

 

VERSAFLOW ONE with strong argumentsErsa Selective Soldering

FluxenVERSAFLOW ONE

Fluxing

The fluxing system of a selective soldering machine must fulfill several requirements at the same time. In addition to precision and speed, high-quality fluxing processes require a high degree of reliability. The PCB areas that are not wetted by the selective soldering waves must not be contaminated with flux. This is why the VERSAFLOW ONE uses state-of-the-art multidrop flux heads from industrial inkjet technology. The flux is not sprayed but applied in individual small drops to previously defined areas.

Preheating

The preheating process is designed to heat the PCB homogeneously before it is transported to the soldering module. The goal here is to provide up to 50 % of the thermal energy using infrared light emitters so that the printed circuit board is not heated in a shock-like manner when it comes into contact with the liquid solder.

Soldering

Mini wave soldering uses a single soldering nozzle that solders each solder joint one after the other. This provides maximum flexibility in combination with the highest quality, as the soldering parameters can be set individually for each solder joint. Like all Ersa selective soldering machines, the VERSAFLOW ONE is equipped with an electromagnetic solder pump. This has the advantage that the lack of mechanically moving parts means that there is only minimal dross, making the pot extremely low-maintenance. The pump ensures an extremely constant flow rate and thus offers a precisely and finely adjustable solder wave height.

Intuitive User Interface

The VERSAFLOW ONE is extremely user-friendly - the intuitive ERSASOFT 5 software stands out here. Thanks to the integrated CAD Assistant 4, creating soldering programs is child's play. No complicated start-up phase means faster profits. Improved heating in the cross profile has reduced the power requirement of the machine, which means energy savings of 10%.

VERSAFLOW ONEErsa Selective Soldering

Technical Data F-SERIES

Transport system:
segmented pin chain conveyor for frameless PCB transport
PCB width:
80-508 mm
PCB length:
120-508 mm
PCB weight:
max. 8 kg
Flux module:
precision spray flux system, 2-axis positioning system
Preheating module:
infrared from below, max. 10.8 kW IR emitter
Solder module mini wave:
solder wave height max. 5 mm
Solder volume:
approx. 14 kg Sn63Pb, approx. 13 kg lead-free alloy
Positioning speed:
0.5-200 mm/s
Positioning accuracy:
+/-0.25 mm

X-SERIES

Transport system:
segmented pin chain conveyor, roller conveyor in the soldering module
PCB width:
80-508 mm
PCB length:
120-610 mm
PCB weight:
max. 8 kg
Flux module:
precision spray flux system, 2-axis positioning system
Preheating module:
infrared from below, max. 14.4 kW IR emitter
Solder module mini wave:
solder wave height max. 5 mm
Solder volume:
approx. 14 kg Sn63Pb, approx. 13 kg lead-free alloy
Positioning speed:
0.5-200 mm/s
Positioning accuracy:
+/-0.25 mm

Intuitive Software

Operation for perfect soldering results

Features:

  • Fast installation
  • Award-winning User interface
  • Intuitive operation
  • Fast soldering program setup

Short delivery times

... thanks to serial production with the most popular system configuration

Features:

  • popular system configuration
  • short delivery times