On October 7 and 8, 2025, the electronics production community gathered in Wertheim am Main for the annual symposium “Soldering in Electronics Production”. Two packed days in front of a record audience of over 100 participants offered a comprehensive overview of soldering processes and technologies, solder paste printing, and fundamental material science knowledge about solder materials, PCBs, and components. From the basics of soft soldering to material properties and surface characterization to process reliability and failure analysis, the presentations showed how in-depth expertise directly leads to more stable, efficient processes.
A highlight was the keynote speech by Fraunhofer ISIT on the influence of design on the quality and reliability of electronic assemblies: production-oriented layouts and smart material selection already pay off in terms of cost efficiency, rework minimization, and functional reliability during development. The rest of the program provided in-depth insights into the basics of soft soldering, solder pastes and fluxes, the use of low-melting-point solders, and best practices for reflow, vapor phase, wave, and selective soldering. Practical and highly relevant: sessions on the solderability of modern packages, stencil printing for new technologies, and professional hand and repair soldering. The event concluded with a look at the reliability of lead-free solder joints, focusing on deformation and degradation mechanisms. Of course, there were also numerous opportunities for networking: discussion panels, a rework forum, lunch, and an evening event promoted intensive exchange between experts from industry and research. We can look back on a successful event and are already looking forward to the next edition in 2026!
